Vacuum Damping Element With A Thermoelectric Element

ABSTRACT

The invention relates to a vacuum damping element ( 1 ) with a casing ( 2 ) which defines a vacuum region. A thermoelectric element ( 3 ), in particular a Peltier element ( 3 ), is arranged within the vacuum region in order to generate a temperature difference between two regions ( 5 ) provided on the outside of the casing ( 2 ).

The present invention relates to a vacuum insulation body comprising athermoelectric element which is preferably configured as a Peltierelement and which is preferably used in refrigerator units and/orfreezer units.

With refrigerator units and/or freezer units, a vacuum insulating bodyis arranged in the region between the outer jacket of the unit and theinner container to be cooled to achieve a sufficiently high thermalinsulation between the outside and the inside of the unit to beinsulated by means of the principle of vacuum thermal insulation.

Thermoelectric elements, in particular Peltier elements, are elementswhich can generate a temperature drop with the aid of electrical energy.The Peltier element comprises two or more small cuboids which are madeup of p-doped and n-doped semiconductor materials and are connected toone another alternatingly at the top and bottom by metallic bridges. Thecuboids are connected to one another such that serial connection is madein which differently doped semiconductor materials are arrangedalternately.

The thermoelectric elements, however, have a comparatively smallefficiency or a small capacity, which has the result that Peltierelements have no extensive use in the cooling of refrigerator unitsand/or freezer units. Thermoelectric elements are only used sporadicallyin the field of coolers in which no large temperature difference isrequired. The use of thermoelectric elements in the field ofrefrigerating technology is therefore restricted to special cases.

Due to the insulation becoming better and better, however, and due tothe reduced cooling power required for cooling which results therefrom,thermoelectric elements, in particular Peltier elements are becoming aninteresting alternative.

On a simultaneous use of a vacuum insulation and a thermoelectricelement, however, the problem arises of effectively integrating the twocomponents. This problem stems from the fact that the cold generationand the heat generation of a thermoelectric element naturally take placedirectly next to one another so that the use of the thermoelectricelement can only be carried out with the aid of a large hole through thevacuum insulation. This results in a reduced insulation performance andin a complicated design of the vacuum insulation and the thermoelectricelement.

These considerations are, however, by no means restricted torefrigerator units and/or freezer units, but also apply to thermallyinsulated containers in general. Thermally insulated containers subjectto these considerations have at least one temperature-controlled innerspace, with this being able to be cooled or heated so that a temperatureresults in the inner space below or above the ambient temperature ofe.g. 21° C.

It is the object of the present invention to eliminate the aboveproblems and to provide an efficient use of a combination ofthermoelectric element and vacuum insulation which has a comparativelysimple design.

This object is achieved by a vacuum insulation body having the featuresof claim 1.

The vacuum insulation body accordingly has at least one envelope whichdefines at least one vacuum zone. At least one thermoelectric element islocated within the vacuum zone to generate a temperature differencebetween two zones provided at the outside of the envelope.

The at least one thermoelectric element is thus preferably locatedcompletely within the vacuum zone of the vacuum body so that openings inthe envelope of the vacuum insulation body for the heat dissipation andheat supply from/to the thermoelectric element can preferably beomitted.

A preferably diffusion-tight envelope or film is required to provide avacuum insulation body in which a vacuum is present. In this respect, acore material can be provided in the vacuum zone that provides thevacuum insulation body with the corresponding shape stability and thatsimultaneously prevents the walls of the envelope directly contactingone another after the generation of a vacuum.

Since the thermoelectric element is provided in the vacuum zone, thetypically large opening of the vacuum insulation is avoided which wasconventionally provided by a thermoelectric element in therefrigeration. A particularly advantageous insulation performance of aninner space bounded by the vacuum insulation body and a veryspace-saving and structured arrangement of the two components resultfrom this arrangement.

The arrangement of the thermoelectric element in the vacuum zoneprovides that a corresponding temperature gradient is present fororienting the thermoelectric element on an operation of thethermoelectric element at the outside of the envelope. This means that,depending on the hot or cold surface of the thermoelectric element, thezones of the envelope facing the hot or cold surface adopt acorresponding temperature. Two different temperature levels are thuspresent at two different points (zones) of the outside of the envelopewhich are caused by the thermoelectric element or can be caused by it.

The arrangement of the thermoelectric element within the vacuum zonealso brings about the advantage that it is protected from externalinfluences. Sealing measures for preventing condensation at the coldpoint of the thermoelectric element or Peltier element can in particularbe dispensed with.

The thermoelectric element preferably has a substantially plate-likebasic shape, with the thermoelectric element having two thermal surfaceswhich preferably extend approximately in parallel with one another andare spaced apart.

In accordance with a further advantageous feature of the invention, thevacuum insulation body has at least one heat conductive body arranged inthe vacuum zone. It is in heat-transferring, preferablythermoconductive, contact with the thermoelectric element and with theenvelope. The thermoconductive body is in direct or indirect contactwith the thermoconductive body and/or with the envelope.

A “thermoconductive body” or a “heat exchanger” is understood within theframework of the present invention as any desired element with whichheat can be transferred, with this heat transfer inter alia comprisingthe heat conduction, but not being restricted thereto.

The named thermoconductive body advantageously has a thermalconductivity λ of at least 3 W/m*K). The thermal conductivity λ of thethermoconductive body is preferably at least 10 W/(m*K), preferably atleast 75 W/(m*K), and particularly preferably at least 150 W/m*K).

It is possible in accordance with the invention to bring thethermoelectric element arranged in the vacuum zone in an effectivethermal (direct or indirect) contact with the envelope. Thethermoconductive body in this respect provides a good thermal couplingof the Peltier element or of the thermoelectric element and the envelopesince the heat exchange via convection in a vacuumed zone is onlypossible in a slowed down manner or is not possible at all.

On a transport of the heat generated and/or removed at the cold surfaceand at the waste heat surface of the thermoelectric element through theenvelope of the vacuum insulation body, the envelope represents asignificant thermal resistance, independent of its thickness, which hasto be overcome.

It is expedient in this respect to provide the thermoconductive body(also called the “primary heat exchanger” in the following), in additionto the thermoelectric element, such that its contact surface with theenvelope is larger than its contact surface with the thermoelectricelement. This has the result that the transfer surface at the envelopeis much larger than the transfer surface of the thermoelectric elementat the thermoconductive body and the temperature dropping over theenvelope is reduced to an acceptable degree. The smaller temperaturedifference which is present at the two sides of the envelope due to thespecific design of the thermoconductive body produces smaller losses atthe envelope overall.

The thermoconductive body or bodies is/are preferably arranged withinthe vacuum zone.

A fixing of the thermoelectric element or elements and of thethermoconductive body or bodies, which are attached within the vacuumzone, preferably takes place with the help of the envelope itself whichhas a specific pressure which is applied from the outside due to itsvacuumed state and said pressure can be used to fix the elementsarranged in the vacuum zone. A partial vacuum arises due to the vacuumpresent in the vacuum zone which can be sufficiently large to achieve alayering of the thermoelectric element with the thermoconductive bodywithout the contact or adhesive bonding with a substance capable of goodthermal conductivity typical for a thermoconductive body beingnecessary. It is therefore not necessary to provide a further elementbetween the envelope and the Peltier element and/or the thermoconductivebody or between the envelope and the thermoconductive body that reducesthe thermal conductivity.

Provision is made in accordance with a preferred embodiment that thethermoelectric element is clamped between the solid bodies which formthe primary heat exchanger.

Provision is preferably made in this respect that the connection elementor elements which connects/connect the solid bodies has/have a smallthermal conductivity so that no significant heat bridge is produced. Itis conceivable to use screws as the connection element or connectionelements. It is also possible to use a part such as an injection moldedpart as a connection element or as connection elements that is fastenedto a molded part and that latches at another molded part on assembly.

Provision is made in an embodiment that no adhesive is provided betweenthe thermoconductive body or bodies and the inside of the film.

However, the case is generally also covered by the invention that meanspromoting the heat transfer, in particular a substance with thermalconductivity e.g. in the form of an adhesive bond, are present betweenthe thermoelectric element and the thermoconductive body or bodies.

Provision is made in an embodiment that the thermoelectric element andthe thermoconductive body are connected to one another using an adhesiveconnection. Provision is preferably made in this respect that anadhesive having a comparatively high thermal conductivity is used, forexample an adhesive in which adhesive compound fillers of good heatconductivity are present. Such an adhesive can also be used for otheradhesive connections used within the framework of the present invention.

In accordance with a further advantageous optional feature of theinvention, the vacuum insulation body furthermore has at least one heatexchanger (also called a “secondary heat exchanger” in the following)that is arranged outside the vacuum zone, that is at the outside of theenvelope. The secondary heat exchanger is thermally coupled to region ofthe envelope that is preferably the region whose temperature can beinfluenced by the thermoelectric element. Thermally coupled includes thepossibility of a direct contact or of a thermal contact.

Provision is preferably made that the thermoconductive body or bodiesare connected to the inside of the film and are not in direct contactwith the secondary heat exchanger. The heat exchange in this case takesplace through the film. This embodiment can be advantageous fortechnical production reasons as well as for reasons of vacuum tightness.It is conceivable that the thickness of the film in the contact regionof the thermoconductive body or bodies is/are reduced with respect tothe other regions to ensure a better heat exchange. Alternatively, thethickness of the film can, however, also be unchanged in these regions,which in turn can be advantageous for technical production reasons aswell as for reasons of vacuum tightness.

Provision can alternatively be made that the thermoconductive body orbodies is/are in direct contact with the secondary heat exchanger andthat cutouts are provided in the film of the envelope in the region ofthe thermoconductive body or bodies. The thermal conduction can thus beoptimized.

The secondary heat exchanger can e.g. be connected to the outer filmside by means of a thermoconductive paste or by a thermoconductiveadhesive.

Provision is made in a preferred embodiment that a thin graphite film isarranged at one side as a coupling element for the mechanical relief ofthe thermoelectric element in the production process, with thethermoelectric element being fixed by clamping between the two solidbodies via the connection elements. At the other side, thethermoconductive adhesive is also used to compensate productiontolerances in the thicknesses of the thermoelectric element, the solidbodies and the connection elements. The graphite film is preferably usedat the hot side since the higher heat flows flow here and the heattransfer resistance through the thin graphite film is typically smallerthan the thermoconductive adhesive layer somewhat thicker due totolerance compensation.

The secondary heat exchanger or heat exchangers are preferably arrangedsuch that a direct or indirect heat exchange takes place from or to theprimary heat exchanger.

The envelope preferably comprises a high barrier film or is a highbarrier film which terminates the vacuum zone formed by the envelope ina vacuum-tight manner.

A vacuum-tight or diffusion-tight envelope or a vacuum-tight ordiffusion-tight connection or the term high barrier film is preferablyunderstood as an envelope or as a connection or as a film by means ofwhich the gas input into the vacuum insulation body is reduced so muchthat the increase in the thermal conductivity of the vacuum insulationbody caused by gas input is sufficiently low over its service life. Atime period of 15 years, preferably of 20 years, and particularlypreferably of 30 years, is to be considered as the service life, forexample. The increase in the thermal conductivity of the vacuuminsulation body caused by gas input is preferably<100%, and particularlypreferably<50%, over its service life.

The surface-specific gas permeation rate of the envelope or of theconnection or of the high barrier film is preferably<10-5 mbar * I/s *m²and particularly preferably<10-6 mbar * I/s *m² (measured according toASTM D-3985). This gas permeation rate applies to nitrogen and tooxygen. There are likewise low gas permeation rates for other types ofgas (in particular steam), preferably in the range from<10-2 mbar *I/s * m² and particularly preferably in the range from<10-3 mbar * I/s *m² (measured according to ASTM F-1249-90). The aforesaid small increasesin the thermal conductivity are preferably achieved by these small gaspermeation rates.

An enveloping system known from the sector of vacuum panels areso-called high barrier films. Single-layer or multilayer films (whichare preferably able to be sealed) having one or more barrier layers(typically metal layers or oxide layers, with aluminum and an aluminumoxide preferably being used as the metal or oxide respectively) arepreferably understood by this within the framework of the presentinvention which satisfy the above-named demands (increase in thermalconductivity and/or surface-specific gas permeation rate) as a barrierto the gas input.

The above-named values or the make-up of the high barrier film areexemplary, preferred values which do not restrict the invention.

In a further advantageous embodiment of the invention, the at least onethermoconductive body and/or one heat exchanger, i.e. the primary and/orthe secondary heat exchanger, is/are itself/themselves a part of theenvelope or forms the total envelope. It is of advantage in this respectthat, on the emission of the temperature difference generated by thethermoelectric element, a thermal resistance which is brought about bythe envelope does not have to be overcome.

If the primary or secondary heat exchanger forms a part of the envelope,the heat exchangers (primary and secondary) can be directly in contactwith one another, which brings along the advantage that the thermalresistance of the film does not have to be overcome.

The vacuum insulation body furthermore preferably comprises a corematerial that is present within the vacuum zone and that is arrangedbetween the individual semiconductor elements of the thermoelectricelement.

The skilled person knows that a thermoelectric element (Peltier element)comprises a plurality of differently doped semiconductor elementsarranged next to one another in a grid-like manner. In this respect, therespective semiconductor elements are spaced apart from one another,with a core material being provided in this region in accordance with anoptional feature of this invention.

The core material is therefore inserted into the region between thesemiconductor pellets of the Peltier element. The gas heat conductionand the radiation heat exchange whose importance in the transfer oftemperature increases in a vacuumed state with an increasing purity ofthe vacuum is thereby effectively suppressed between the hot and coldside of the thermoelectric element. Overall, this results in an increasein performance of the thermoelectric element, whereby a moreresource-efficient cooling or heating is possible.

In addition, the present invention describes a thermoelectric elementthat comprises at least one n-doped semiconductor element and at leastone p-doped semiconductor element. The p-doped semiconductor element isconnected via a conductor bridge to the n-doped semiconductor element,with the two semiconductor elements being spaced apart from one anotherso that a free space is formed between them. The thermoelectric elementin accordance with the invention is characterized in that the free spacebetween the p-doped semiconductor element and the n-doped semiconductorelement is filled with a material in powder form.

The material in powder form preferably has a mean grain size in which apowder grain is between 5 μm and 30 μm, preferably between 10 μm and 25μm, and particularly preferably between 15 μm and 20 μm.

Another name for the differently doped semiconductor elements of thethermoelectric element is semiconductor pellets. The material in powderform inserted between the space of the semiconductor pellets preventsconvection between the hot surface and the cold surface of thethermoelectric element. The effectiveness of the thermoelectric elementcan thus be increased.

The present invention furthermore relates to a vacuum insulation body inaccordance with one of the above-described variants in which thethermoelectric element has a material in powder form in the free spacebetween the differently doped semiconductor elements. This material inpowder form is in this respect simultaneously also a core material forthe vacuum insulation body. Not only the performance capability of thethermoelectric element can thus be increased, but rather the advantagesassociated with the core material can also simultaneously be achieved.An encapsulation of the thermoelectric element from the core material isnot necessary in this respect due to the material identity.

In addition, the present invention relates to a thermally insulatedcontainer having at least one carcass and having at least onetemperature-controlled inner space, preferably to a refrigerator unitand/or freezer unit having at least one carcass and having at least onerefrigerated inner space which is surrounded by the carcass as well ashaving at least one closing element by means of which thetemperature-controlled and preferably the refrigerated inner space canbe closed. At least one intermediate space in which at least one vacuuminsulation body in accordance with the invention and/or a thermoelectricelement in accordance with the invention is located between thetemperature-controlled and preferably the refrigerated inner space andthe outer wall of the container and preferably of the unit.

The vacuum insulation body can be located between the outside of thecarcass in the inner container and/or between the outside and the insideof the door or of another closing element.

In a preferred embodiment of the container in accordance with theinvention and preferably of the refrigerator unit and/or freezer unit inaccordance with the invention, it is partly or completely insulated withthe help of a full vacuum system. It is in this respect an arrangementwhose thermal insulation between the outside and the inner space at thecarcass and/or at the closing element only or primarily comprises anevacuated element, in particular in the form of the envelope ofvacuum-tight film or high barrier film with a core material. The fullvacuum insulation is preferably formed by one or more vacuum insulationbodies in accordance with the invention. A further thermal insulation byan insulating foam and/or by vacuum insulation panels or by anothermeans for thermal insulation between the inside and the outside of theunit is preferably not provided.

This preferred form of thermal insulation in the form of a full vacuumsystem can extend between the wall bounding the inner space and theouter skin of the carcass and/or between the inner side and the outerside of the closing element such as a door, flap, lid, or the like.

The full vacuum system can be obtained such that an envelope of agas-tight film is filled with a core material and is subsequently sealedin a vacuum-tight manner. In an embodiment, both the filling and thevacuum-tight sealing of the envelope take place at normal or ambientpressure. The evacuation then takes place by the connection to a vacuumpump of a suitable interface worked into the envelope, for example anevacuation stub which can have a valve. Normal or ambient pressure ispreferably present outside the envelope during the evacuation. In thisembodiment, it is preferably not necessary at any time of themanufacture to introduce the envelope into a vacuum chamber. A vacuumchamber can be dispensed with in an embodiment to this extent during themanufacture of the vacuum insulation.

The temperature-controlled inner space is either cooled or heateddepending on the type of the unit (cooling appliance, heating cabinet,etc.).

Provision is made in an embodiment that the container in accordance withthe invention is a refrigerator unit and/or a freezer unit, inparticular a domestic appliance or a commercial refrigerator. Such unitsare, for example, covered which are designed for a stationaryarrangement at a home, in a hotel room, in a commercial kitchen or in abar. It can, for example, be a wine cooler. Chest refrigerators and/orfreezers are furthermore also covered by the invention. The units inaccordance with the invention can have an interface for connection to apower supply, in particular to a domestic mains supply (e.g. a plug)and/or can have a standing aid or installation aid such as adjustmentfeet or an interface for fixing within a furniture niche. The unit can,for example, be a built-in unit or also a stand-alone unit.

In an embodiment, the container or the unit is configured such that itcan be operated at an AC voltage such as a domestic mains voltage ofe.g. 120 V and 60 Hz or of 230 V and 50 Hz. In an alternativeembodiment, the container or the unit is configured such that it can beoperated with DC current of a voltage of, for example, 5 V, 12 V or 24V. Provision can be made in this embodiment that a plug-in power supplyis provided inside or outside the unit via which the unit is operated.An advantage of the use of thermoelectric heat pumps in this embodimentis that the whole EMC problem only occurs at the power pack.

Provision can in particular be made that the refrigerator unit and/orfreezer unit has a cabinet-type design and has a useful space which isaccessible to a user at its front side (at the upper side in the case ofa chest). The useful space can be divided into a plurality ofcompartments which are all operated at the same temperature or atdifferent temperatures. Alternatively, only one compartment can beprovided. Storage aids such as trays, drawers or bottle-holders (alsodividers in the case of a chest) can also be provided within the usefulspace or within a compartment to ensure an ideal storage of refrigeratedgoods or frozen goods and an ideal use of the space.

The useful space can be closed by at least one door pivotable about avertical axis. In the case of a chest, a lid pivotable about ahorizontal axis or a sliding cover is conceivable as the closingelement. The door or another closing element can be connected in asubstantially airtight manner to the carcass by a peripheral magneticseal in the closed state. The door or another closing element ispreferably also thermally insulated, with the thermal insulation beingable to be achieved by a foaming and optionally by vacuum insulationpanels or also preferably by a vacuum system and particularly preferablyby a full vacuum system. Door storage areas can optionally be providedat the inside of the door in order also to be able to store refrigeratedgoods there.

It can be a small appliance in an embodiment. In such units, the usefulspace defined by the inner wall of the container has, for example, avolume of less than 0.5 m³, less than 0.4 m³ or less than 0.3 m³.

The outer dimensions of the container or unit are preferably in therange up to 1 m with respect to the height, width and depth.

The invention is, however, not restricted to refrigerator units and/orfreezer units, but rather generally applies to units having atemperature-controlled inner space, for example also to heat cabinets orheat chests.

Further particulars and details will be explained with reference to thefollowing description of the Figures. There is shown:

FIG. 1: a cross-sectional view of a vacuum insulation body in accordancewith the invention with a thermoelectric element.

FIG. 1 shows a vacuum insulation body 1 whose vacuum zone is defined,i.e. bound, by a vacuum-tight envelope 2. The envelope is preferably ahigh barrier film.

In addition, a thermoelectric element 3 can be recognized havingsemiconductor pellets which connect the two thermoconductive bodies 4 orextend between them in the drawing. The thermoelectric element 3 has twosurfaces 31, 32, between which a temperature drop can be adopted, in adirection extending transversely to the alignment of the semiconductorpellets. To transport the temperature present at these surfaces 31, 32efficiently to marginal regions of the envelope 2, the respectivethermoconductive bodies 4 are connected both to the envelope 2 and tothe surface 31, 32 of the thermoelectric element 3.

The thermoconductive bodies 4 have a cross-sectional area whichincreases in size toward the margin of the vacuum insulation bodystarting from the thermoelectric element 3.

In addition, a heat exchanger 5 can be recognized which is arrangedoutside the vacuum zone and which is configured to take up or emit theheat transported through the respective thermoconductive bodies 4.

The thermoconductive bodies 4 and the heat exchanger 5, i.e. the primary4 and the secondary heat exchanger 5, are thermoconductively connectedto one another. The heat conduction takes place through the thin film.Provision can be made, as shown in the drawing, that the thickness ofthe films 2 is reduced with respect to the other regions at the insideand outside in the region of the heat exchanger 4 to ensure a betterheat exchange. Alternatively, the thickness of the film 2 can, however,also be unchanged in this region, which is advantageous in productionand increases the vacuum-tightness of the system.

Vacuum is present within the vacuum insulation body so that thethermoelectric element 3 and the primary heat exchangers 4 are locatedcompletely within the evacuated zone.

A support core, for example in the form of a powder, and preferably inthe form of Pearlite powder, is furthermore present within the evacuatedregion between the films. If this powder is also present between thesemiconductor pellets of the Peltier element, both the gas thermalconduction and the radiation heat exchange between the hot and coldsides of the Peltier element or of the thermoelectric element arethereby suppressed.

1. A vacuum insulation body having an envelope which defines a vacuumzone, characterized in that a thermoelectric element, in particular aPeltier element is arranged within the vacuum zone to generate atemperature difference between two zones provided at the outside of theenvelope.
 2. A vacuum insulation body in accordance with claim 1,characterized in that the thermoelectric element has a substantiallyplate-like basic shape and two thermal surfaces which preferably extendapproximately in parallel with one another and are spaced apart from oneanother.
 3. A vacuum insulation body in accordance with claim 1,characterized in that a thermoconductive body arranged in the vacuumzone is furthermore provided which is in heat-transferring, inparticular in thermoconductive contact or in direct contact with thethermoelectric element and the envelope.
 4. A vacuum insulation body inaccordance with claim 3, wherein a contact surface between thethermoconductive body and the envelope is larger than a contact surfacebetween the thermoconductive body and the thermoelectric element.
 5. Avacuum insulation body in accordance with claim 1, furthermore having aheat exchanger which is arranged outside the vacuum zone, wherein theheat exchanger is thermally coupled to a region of the envelope,preferably in a region whose temperature can be influenced by thethermoelectric element.
 6. A vacuum insulation body in accordance withclaim 1, characterized in that the envelope comprises a high barrierfilm or is a high barrier film; and/or in that a core material, inparticular Pearlite, is located in the vacuum zone.
 7. A vacuuminsulation body in accordance with claim 5, characterized in that theheat exchanger itself represents a part of the envelope or the totalenvelope.
 8. A thermoelectric element, in particular a Peltier element,comprising: at least one n-doped semiconductor element; and at least onep-doped semiconductor element that is connected to the n-dopedsemiconductor element via a conductor bridge, wherein the twosemiconductor elements are spaced apart from one another such that afree space is formed between them, characterized in that the free spacebetween the n-doped semiconductor material and the p-doped semiconductormaterial is filled with a material in powder form, with provisionpreferably being made that the material in powder form has a mean grainsize of a powder grain which is between 5 μm and 30 μm, preferablybetween 10 μm and 25 μm, and particularly preferably between 15 μm and20 μm.
 9. A vacuum insulation body having an envelope which defines avacuum zone, characterized in that a thermoelectric element, inparticular a Peltier element is arranged within the vacuum zone togenerate a temperature difference between two zones provided at theoutside of the envelope, characterized in that the thermoelectricelement is configured in accordance with claim 8; and in that thematerial in powder form is preferably simultaneously a core material ofthe vacuum insulation body.
 10. A thermally insulated container havingat least one carcass and having at least one temperature-controlledinner space, preferably a refrigerator unit and/or a freezer unit havingat least one carcass and having at least one refrigerated inner spacewhich is surrounded by the carcass, as well as having at least oneclosing element by means of which the temperature-controlled inner spaceand preferably the refrigerated inner space is closable, wherein atleast one intermediate space is present between thetemperature-controlled inner space and preferably the refrigerated innerspace and the outer wall of the container and preferably of the unit,characterized in that at least one vacuum insulation body in accordancewith claim 1 is arranged in the intermediate space.
 11. A thermallyinsulated container having at least one carcass and having at least onetemperature-controlled inner space, preferably a refrigerator unitand/or a freezer unit having at least one carcass and having at leastone refrigerated inner space which is surrounded by the carcass, as wellas having at least one closing element by means of which thetemperature-controlled inner space and preferably the refrigerated innerspace is closable, wherein at least one intermediate space is presentbetween the temperature-controlled inner space and preferably therefrigerated inner space and the outer wall of the container andpreferably of the unit, characterized in that a thermoelectric elementin accordance with claim 8 is arranged in the intermediate space.